반도체의부가가치를올리는패키지와테스트
서민석
- 책소개 -
이 책은 반도체 패키지와 테스트의 입문서입니다. 반도체 업계에 입문하려는 학생들에게는 방향을 제시하는 지침서의 역할을 하 게 될 것입니다. 또한 패키지와 테스트 관련 업무에 종사하는 분들과 유관 업무를 하고 계신 분 들에게는 이해도를 향상시켜드리게 될 것입니다. 나아가 패키지, 테스트의 장비와 소재를 만드는 분들에게도 이 책의 지식들이 해 당 업무의 효율을 높이는 데 기여할 것이라 생각됩니다.
제1장에서는 테스트 장비와 프로세스, 대략적인 테스트 항목에 대해 설명하였고, 제2장에서는 패키지의 정의와 역할, 기술 개발 트렌드, 기술 개발 프로세스 등을 설 명하였습니다. 제3장에서는 패키지의 종류를 분류하고, 각 종류별 특징, 장단점 등을 기술하였습니다.
제4장에서는 패키지 설계와 해석을 설명하였는데, 패키지 설계와 칩 설계의 차이점을 알리고, 설계 및 공정 효율을 높이기 위한 구조, 열, 전기 해석 내용과 과정 을 소개하였습니다. 제5장은 패키지 공정을 설명하는 장인데, 종류별 공정 순서와 각 공정들의 진행방 법과 의미를 소개하였습니다.
제6장에서는 패키지 공정 진행을 위해서 사용되는 재료들을 소개하였고, 제7장에서는 품질과 신뢰성의 의미 및 신뢰성 평가 항목들의 진행 방법과 목적을 설명하였습니다.
- 목차 -
01 반도체
테스트의 이해
01. 반도체 후공정 ······················································ 5
02. 테스트의 종류······················································ 8
03. 웨이퍼 테스트 ···················································· 10
EPM ································································ 13
웨이퍼 번인······················································· 13
테스트 ····························································· 14
리페어······························································ 15
04. 패키지 테스트 ···················································· 16
TDBI································································ 17
테스트 ····························································· 18
외관 검사·························································· 18
02 반도체
패키지의 정의와 역할
01. 반도체 패키지의 정의········································· 25
02. 반도체 패키지의 역할 ········································ 26
03. 반도체 패키지의 개발 트렌드····························· 28
04. 반도체 패키지 개발 과정 ··································· 31
03 반도체
패키지의 종류
01. 반도체 패키지의 분류······················································ 39
02. 컨벤셔널 패키지·······························································41
플라스틱 패키지 - 리드프레임 타입 패키지··························41
플라스틱 패키지 - 서브스트레이트 타입 패키지 ·················· 43
세라믹 패키지 ································································ 46
03. 웨이퍼 레벨 패키지························································· 47
웨이퍼 레벨 패키지 ························································· 47
재배선··········································································· 56
플립 칩·········································································· 58
04. 적층 패키지····································································· 66
패키지 적층 ··································································· 67
칩 적층 - Chip Stack with Wire Bonding··························· 70
실리콘 관통 전극 - Chip Stack with TSV ··························· 73
05. 시스템 인 패키지····························································· 86
04 반도체
패키지 설계와 해석
01. 반도체 패키지 설계 ························································· 97
02. 구조 해석······································································· 101
휨 해석········································································ 104
솔더 접합부 신뢰성 ······················································· 106
강도 해석····································································· 108
03. 열 해석 ·········································································· 109
04. 전기 해석 ······································································113
05 반도체
패키지 공정
01. 컨벤셔널 패키지 공정·······································123
백 그라인딩 ····················································124
웨이퍼 절단·····················································127
다이 어태치 ····················································131
인터커넥션······················································137
몰딩·······························································143
마킹·······························································144
트리밍 – 리드프레임·········································146
솔더 도금 – 리드프레임·····································147
성형 – 리드프레임············································147
솔더 볼 마운팅 – 서브스트레이트 ·······················148
싱귤레이션 - 서브스트레이트 ····························152
02. 웨이퍼 레벨 패키지 공정··································153
포토 공정 ·······················································156
스퍼터링 공정 ················································· 161
전해도금 공정 ·················································163
습식 공정 – PR 스트립과 금속 에칭 ····················166
팬인 WLCSP 공정············································167
솔더 볼 마운팅 공정·········································168
플립 칩 범프 공정 ············································169
재배선 공정 ····················································171
팬아웃 WLCSP 공정·········································172
실리콘 관통 전극 패키지 공정···························· 174
03. 검사와 측정······················································187
검사·······························································187
측정·······························································192
06 반도체
패키지 재료
01. 컨벤셔널 패키지 재료···················································· 208
리드프레임 ·································································· 208
서브스트레이트···························································· 210
접착제········································································· 217
에폭시 몰딩 컴파운드···················································· 222
솔더 ··········································································· 225
테이프········································································· 228
와이어 ········································································ 229
포장 재료 ···································································· 230
02. 웨이퍼 레벨 패키지 재료··············································· 231
포토 레지스트 ······························································ 231
도금 용액····································································· 234
PR 스트립퍼································································· 235
에천트········································································· 237
스퍼터 타깃 ································································· 238
언더필········································································· 238
캐리어와 접착제, 마운팅 테이프······································ 240
07 반도체
패키지 신뢰성
01. 신뢰성 의미 ··································································· 247
02. JEDEC 기준··································································· 248
03. 수명 신뢰성 시험··························································· 253
EFR ············································································ 253
HTOL ········································································· 254
LTOL ·········································································· 255
HTSL ·········································································· 256
LTSL··········································································· 257
Endurance ····················································· 257
Data Retention··············································· 258
04. 환경 신뢰성 시험·············································· 259
Preconditioning·············································· 259
TC ································································· 263
TS ································································· 268
THS······························································· 268
PCTP······························································269
UHAST ·························································· 270
HAST····························································· 271
HALT····························································· 272
05. 기계적 신뢰성 시험·········································· 273
충격································································274
진동······························································· 275
구부림 ··························································· 275
비틀림·····························································276
08 반도체
용어해설
용어해설·································································· 282
- 저자소개 -
서민석 박사는 한국과학기술원 재료공학과에서 학사,석사 학위를 취득하였고, 반도체 패키지를 위한 전해 도금 공정 및 재료 연구로 박사학위를 취득하였다.
이후 SK하이닉스 반도체에서 SRAM & Flash 공정 개발에 참여하였다가 2003년부터 반도체 패키지 개발 부서에서 RDL, Flip Chip, Fan in WLCSP, TSV(HBM, 3DS, Wide IO)등의 Wafer Level Package 개발을 주관하였다.
| 도서명 | 상세설명페이지 참고 |
|---|---|
| 저자 | 상세설명페이지 참고 |
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|---|---|
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| 결제수단 | 환불시점 | 환불방법 |
|---|---|---|
| 신용카드 | 취소완료 후, 3~5일 내 카드사 승인취소(영업일 기준) | 신용카드 승인취소 |
| 계좌이체 |
실시간 계좌이체 또는 무통장입금 취소완료 후, 입력하신 환불계좌로 1~2일 내 환불금액 입금(영업일 기준) |
계좌입금 |
| 휴대폰 결제 |
당일 구매내역 취소시 취소 완료 후, 6시간 이내 승인취소 전월 구매내역 취소시 취소 완료 후, 1~2일 내 환불계좌로 입금(영업일 기준) |
당일취소 : 휴대폰 결제 승인취소 익월취소 : 계좌입금 |
| 포인트 | 취소 완료 후, 당일 포인트 적립 | 환불 포인트 적립 |
- 단순변심으로 인한 반품 시, 배송 완료 후 7일이 지나면 취소/반품 신청이 접수되지 않습니다.
- 주문/제작 상품의 경우, 상품의 제작이 이미 진행된 경우에는 취소가 불가합니다.
- 구성품을 분실하였거나 취급 부주의로 인한 파손/고장/오염된 경우에는 취소/반품이 제한됩니다.
- 제조사의 사정 (신모델 출시 등) 및 부품 가격변동 등에 의해 가격이 변동될 수 있으며, 이로 인한 반품 및 가격보상은 불가합니다.
- 뷰티 상품 이용 시 트러블(알러지, 붉은 반점, 가려움, 따가움)이 발생하는 경우 진료 확인서 및 소견서 등을 증빙하면 환불이 가능하지만 이 경우, 제반 비용은 고객님께서 부담하셔야 합니다.
- 각 상품별로 아래와 같은 사유로 취소/반품이 제한 될 수 있습니다.
| 상품군 | 취소/반품 불가사유 |
|---|---|
| 의류/잡화/수입명품 | 상품의 택(TAG) 제거/라벨 및 상품 훼손으로 상품의 가치가 현저히 감소된 경우 |
| 계절상품/식품/화장품 | 고객님의 사용, 시간경과, 일부 소비에 의하여 상품의 가치가 현저히 감소한 경우 |
| 가전/설치상품 | 전자제품 특성 상, 정품 스티커가 제거되었거나 설치 또는 사용 이후에 단순변심인 경우, 액정화면이 부착된 상품의 전원을 켠 경우 (상품불량으로 인한 교환/반품은 AS센터의 불량 판정을 받아야 합니다.) |
| 자동차용품 | 상품을 개봉하여 장착한 이후 단순변심의 경우 |
| CD/DVD/GAME/BOOK등 | 복제가 가능한 상품의 포장 등을 훼손한 경우 |
| 상품의 시리얼 넘버 유출로 내장된 소프트웨어의 가치가 감소한 경우 | |
| 노트북, 테스크탑 PC 등 | 홀로그램 등을 분리, 분실, 훼손하여 상품의 가치가 현저히 감소하여 재판매가 불가할 경우 |
