전산/통신/전기

반도체 제조기술의 이해(2판)

곽노열,배병욱,오경택,윤태균,이성희,임정훈,정용우,진수봉,최호승,홍기환

고객평점
발행일2021.08.20
판형변형판
쪽수719
ISBN9791166471070
판매가격 59,800원
배송비결제주문시 결제

총 금액 : 0원

  • 페이스북으로 보내기
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  • 네이버밴드로 보내기
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  • 텀블러로 보내기
  • 핀터레스트로 보내기

[도서소개]

종합적인 반도체 제조업체에서는 이미 패키지와 테스트에 관련된 실무 전문성 있는 책자를 2020년에 발간한 바 있으며 본 책자는 그 후속편이라 할 수 있겠습니다.

이 책자가 반도체업에 종사하는 모든 분들께 도움이 될 것으로 생각하며 특히 메모리 반도체인 DRAM과 NAND의 기본적인 이해 및 FabFabrication, 

반도체 공장의 제조공정과 각종 장비에 대한 궁금증 또는 필요성이 있는 직접 관련 업무의 종사자분들, 반도체 산업의 기반이라 할 수있는 재료, 부품, 장비업에 종사하시는 분들, 

그리고 교육 현장에서 학생들을 가르치시는 선생님들과 미래의 반도체 세계최고 전문가를 꿈꾸는 대한민국의 많은 희망들께 도움이 될 것으로 기대합니다. 

다만 한 가지 아쉬운 점은 산업 보안 등의 이유로 저자들이 담고자 했던 내용들을 온전히 담지 못한것이며, 이에 대해서는 독자 여러분들의 넓은 이해를 구하고자 합니다.




[목차]

01 반도체 개요

● 반도체 제조기술 개요···················································5


01. 반도체 정의····································································· 7

● 반도체란?···································································7

● 반도체의 종류 ····························································8


02. 반도체 역사···································································· 9

● 트랜지스터 ·································································9

● 메모리 ···································································· 12

● 세계 메모리 반도체 선도하는 대한민국·························· 15


03. 미래 메모리 반도체························································ 17

● 메모리 시장······························································ 17

● 기술적인 한계··························································· 18

● PCRAM 제품·····························································20

● ReRAM 제품 ····························································25

● STT-MRAM 제품·······················································27

● 요약········································································31



02 DRAM Memory 제품

01. DRAM Memory 소개·····················································37

● DRAM이란? ·····························································37

● DRAM 운용 제품별 특징·············································39


02. DRAM 기본 동작 소개···················································· 41

● MOSFET·································································· 41

● DRAM Architecture ··················································45

● 주요 동작 소개··························································48

● SWD, S/A 동작 이해···················································52

● REFRESH ·······························································55


03. DRAM 주요 Process Module·········································57

● ISO / GATE·······························································57

● SAC·········································································59

● SN·········································································· 61

● MLM·······································································62


04. DRAM 변화 방향···························································64

● DRAM Memory 기술 변화 요구···································64



03 NAND Memory 제품

01. NAND FLASH Memory 소개··········································73

● FLASH Memory란?···················································73

● FLASH Memory Market Trend···································· 76


02. NAND FLASH 기본 동작 소개·········································79

● NAND Architecture···················································79

● Erase/Read/Write Operation······································83

● Cell의 형태 및 String 구조···········································93

● ISPP········································································97

● Cell 분포 및 Multi bit cell ···········································99


03. 3D NAND 구조 소개···················································· 103

● 2D NAND와 3D NAND············································103

● PUC 구조·······························································106

● CTF·······································································107

● Pipe와 Pipeless ······················································ 110

● 3D NAND Process Sequence····································111


04. 3D NAND Key Process··············································· 115

● PLUG···································································· 115

● ONOP··································································· 119

● SLIM····································································· 121


05. Future NAND FLASH Memory···································· 123

● 3D Re-NAND·························································123

● 3D Fe-NAND·························································124

● SGVC····································································124



04 Diffusion_Furnace 공정

01. Diffusion 소개···························································· 131

● Diffusion 정의·························································132

● Diffusion 대표 공정 및 소재 소개································133

● Diffusion 대표 장비 소개···········································137


02. Furnace공정 이해·······················································142

● Diffusion공정 소개··················································142

● Oxidation공정 소개·················································142

● LPCVD·································································· 149

● ALD공정································································160


03. Furnace 장비의 이해 ··················································· 170

● Furnace 장비 소개··················································· 170

● Batch 장비····························································· 171

● Chamber 장비 소개················································· 179


04. 공정과 장비 관리 소개··················································186

● 전산 시스템 활용 관리··············································186

● PM········································································186


05. 미래 기술 해결 과제······················································188



05 Diffusion (Ion Implant)

01. Ion Implantation공정 개요··········································· 195

● Ion Implantation공정의 역사와 정의··························· 195

● Ion Implantation 관련 주요 공정································197

● Ion Implantation공정의 주요 장비······························198

● Ion Implantation 장비의 주요 구성·····························200


02. DRAM/NAND Ion Implantation Application·················200

● Well Formation·······················································201

● Threshold Adjust Implant·········································202

● Source/Drain Implant··············································202

● Lightly Doped Drain················································203


03. Ion Implantation 구성과 Hardware······························205

● Gas 구성································································205

● HW 기본 구성·························································208


04. Ion Implantation Physics············································ 217

● Scattering 현상······················································· 218

● Stopping Mechanism··············································· 218

● Ion Projection Range···············································221

● Channeling Effect···················································222

● Shadowing Effect···················································224

● Damage Engineering···············································225

● Annealing······························································227

● RTA 도입 및 특징·····················································228

● 이온주입 후의 Monitoring 방법··································230


05. Ion Implantation 관련 미래 기술···································232

● Cold & Hot Implantation··········································232

● Plasma Doping·······················································233

● Co Implantation······················································235

● Advanced Anneal···················································237


 

06 Thinfilm_ CVD 공정

01. CVD공정 소개 ····························································245

● CVD공정 정의·························································246


02. CVD공정의 역할 및 이해···············································248

● 절연막 역할····························································248

● Gap fill 특성····························································251

● HARD MASK 역할···················································252

● Low-k 절연막·························································253


03. CVD 제조 Fab 장비의 이해············································254

● 장비 관리 특성························································255

● 주요 부품 특성의 이해··············································257


04. CVD 주요 공정 장비의 소개···········································263

● PE CVD USG공정····················································263

● Thermal CVD BPSG공정··········································264

● PE CVD ARC공정····················································266

● HDP공정································································268

● SOD공정································································271

● PE Nitride공정························································273

● ACL Hard Mask공정·················································273

● Low-k공정·····························································275

● NDC공정································································276

● Gate ON Stack공정·················································277


05. CVD 장비 향후 Trends·················································278



07 Thinfilm_ PVD 공정

01. PVD공정····································································285

● PVD공정 소개·························································285


02. PVD공정의 요구사항····················································286


03. Metal 물질의 특성·······················································286

● Aluminum 물질·······················································287

● Titanium 물질·························································287

● Tungsten 물질························································288

● Cobalt 물질····························································289

● Tantalum 물질························································289

● Copper 물질···························································290


04. PVD 주요 특성의 이해··················································290

● Sheet Resistance····················································290

● Contact Silicide 특성················································291

● EM 현상·································································292

● ALD 방식·······························································293

● Damascene 구조·····················································293


05. PVD공정의 Fab 장비의 이해·········································294

● Sputter공정 장비·····················································296

● Contact Silicide·······················································300

● ALD TiN 장비·························································302

● CVD W 장비···························································304

● LFW 장비·······························································307

● EP Cu 장비·····························································309

● Cu Barrier Metal 장비·············································· 312


06. PVD공정 향후 Trends·················································· 314



08 Photo 공정

01. Photo공정의 역할························································321

● Photo공정 소개·······················································321

● Photo Process의 이해··············································322

● Photo 장비의 종류···················································324

● Photo에 사용되는 소재·············································328


02. Photo공정·································································330

● Imaging·································································330

● Focus····································································336

● Dose·····································································338

● Leveling·································································339

● Overlay··································································339

● Alignment······························································ 341

● Overlay··································································345

● Overlay Control······················································348

● MASK····································································353

● Photo Resist···························································357


03. Photo 장비·································································363

● Track·····································································363

● Scanner·································································370


04. Photo공정 관리··························································377

● Overlay··································································377

● Incell·····································································379

● CD········································································379

● Defect···································································381


05. Photo 미래 기술··························································382

● 차세대 Photo Graphy 기술········································382

● EUV란···································································386

● 기존 ArF와의 차이점················································387

● EUV 기술의 문제점··················································388



09 Etch 공정

01. Etch 소개···································································397

● 실생활에서 본 Etch Engineering 개요 ························397


02. Etch 기본···································································402

● FAB공정과 반도체 소자············································402

● Etch의 원리와 메커니즘············································408

● 플라즈마 정의와 성질··············································· 413

● Etch 고려사항························································· 419

● Etch공정관리를 위한 결과물······································431

● 식각 가스와 식각 물질 ·············································440


03. Etch 적용과 응용·························································444

● Etch 대표 구조공정··················································444

● Etch 장비 구성과 종류··············································454

● Plasma Source에 따른 Etch 장비 구분························465


04. ETCH 실전, 양산 FAB에서 ETCH 엔지니어 업무··············· 476

● 팹에서의 양산 기술·················································· 476

● Etch 장비의 유지 관리··············································482

● 양산에서 Etch가 가지는 어려움··································487

● Etch 양산 엔지니어의 하루········································489


05. Etch Issue 및 향후 개발 방향········································490

● 반도체 미세화 트렌트와 식각 이슈······························490

● 기술적 한계 극복 방안과 기술 발전 방향······················492



10 Cleaning 공정

01. Cleaning공정······························································507

● Cleaning공정 소개···················································507


02. Cleaning Chemical의 종류와 특징 ································ 511

● SPM 세정······························································· 511

● APM 세정······························································· 514

● DHF / BOE 세정······················································ 517

● H3PO4, Phosphoric Acid 세정····································520

● Ozone 세정 ···························································521

● NFAM 세정····························································525

● Function Water 세정················································527

● HF/NH3 Gas 건식 세정·············································531


03. Cleaning 장비의 종류와 특징 ········································534

● Batch Type····························································534

● Wet Single Type·····················································537

● Dry Single Type······················································539

● Scrubber 세정························································542


04. Cleaning공정의 품질 관리와 생산장비 관리····················544

● defect ··································································544

● Uniformity ····························································546

● Contamination ·······················································548

● Fume····································································548

● Cross contamination···············································550

● Selectivity······························································552

● Leaning·································································553

● Flow Rate······························································555

● Temperature··························································557

● Concentration ·······················································559

● Exhaust ······························································· 561

● Pressure ·······························································563


05. Cleaning의 미래기술 ····················································565



11 CMP 공정

01. CMP공정 소개·····························································573


02. CMP공정의 종류와 특징···············································578

● Planarization··························································578

● Isolation·································································580

03. CMP 장비의 구성과 특징··············································582


● Polisher·································································582

● Cleaner··································································584

● EPD······································································587


04. CMP공정의 품질 관리와 생산 장비 관리··························591

● Defect, Scratch·······················································591

● Uniformity, APC······················································594

● Slurry ···································································596

● Selectivity······························································599

● Dishing, Erosion······················································600

● Pad ······································································602

● Disk ······································································604

● Membrane·····························································605

● Retainer Ring ·························································609

● Brush ··································································· 610

● Filter ·····································································611


05. CMP의 미래 기술 ························································ 613



12 MI (Metrology & Inspection)

01. Metrology ·································································621

● Metrology 개론·······················································621

● Device 박막 두께 측정··············································621

● Device 구조/형태 측정·············································626

● 박막 조성/물성 측정·················································631

● 휨 측정··································································638


02. Inspection·································································639

● Inspection 개론·······················································639

● BF/DF 검사·····························································640

● 파티클 카운터·························································643

● 매크로 검사····························································645

● 전자빔 검사····························································645


03. 공정 계측 응용기술······················································648

● 가상계측································································648

● 측정 검사 기술 동향과 미래······································649



13 반도체 용어해설

반도체 용어해설·································································656




[저자소개]

곽노열,배병욱,오경택,윤태균,이성희,임정훈,정용우,진수봉,최호승,홍기환 






상품요약정보 : 서적
상품정보고시
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거래조건에 관한 정보
거래조건
재화 등의 배송방법에 관한 정보 상품 상세설명페이지 참고
주문 이후 예상되는 배송기간 상품 상세설명페이지 참고
제품하자가 아닌 소비자의 단순변심, 착오구매에 따른 청약철회 시 소비자가 부담하는 반품비용 등에 관한 정보 배송ㆍ교환ㆍ반품 상세설명페이지 참고
제품하자가 아닌 소비자의 단순변심, 착오구매에 따른 청약철회가 불가능한 경우 그 구체적 사유와 근거 배송ㆍ교환ㆍ반품 상세설명페이지 참고
재화등의 교환ㆍ반품ㆍ보증 조건 및 품질보증 기준 소비자분쟁해결기준(공정거래위원회 고시) 및 관계법령에 따릅니다.
재화등의 A/S 관련 전화번호 상품 상세설명페이지 참고
대금을 환불받기 위한 방법과 환불이 지연될 경우 지연에 따른 배상금을 지급받을 수 있다는 사실 및 배상금 지급의 구체적 조건 및 절차 배송ㆍ교환ㆍ반품 상세설명페이지 참고
소비자피해보상의 처리, 재화등에 대한 불만처리 및 소비자와 사업자 사이의 분쟁처리에 관한 사항 소비자분쟁해결기준(공정거래위원회 고시) 및 관계법령에 따릅니다.
거래에 관한 약관의 내용 또는 확인할 수 있는 방법 상품 상세설명페이지 및 페이지 하단의 이용약관 링크를 통해 확인할 수 있습니다.
01. 반품기한
  • 단순 변심인 경우 : 상품 수령 후 7일 이내 신청
  • 상품 불량/오배송인 경우 : 상품 수령 후 3개월 이내, 혹은 그 사실을 알게 된 이후 30일 이내 반품 신청 가능
02. 반품 배송비
반품 배송비
반품사유 반품 배송비 부담자
단순변심 고객 부담이며, 최초 배송비를 포함해 왕복 배송비가 발생합니다. 또한, 도서/산간지역이거나 설치 상품을 반품하는 경우에는 배송비가 추가될 수 있습니다.
상품의 불량 또는 오배송 고객 부담이 아닙니다.
03. 배송상태에 따른 환불안내
환불안내
진행 상태 결제완료 상품준비중 배송지시/배송중/배송완료
어떤 상태 주문 내역 확인 전 상품 발송 준비 중 상품이 택배사로 이미 발송 됨
환불 즉시환불 구매취소 의사전달 → 발송중지 → 환불 반품회수 → 반품상품 확인 → 환불
04. 취소방법
  • 결제완료 또는 배송상품은 1:1 문의에 취소신청해 주셔야 합니다.
  • 특정 상품의 경우 취소 수수료가 부과될 수 있습니다.
05. 환불시점
환불시점
결제수단 환불시점 환불방법
신용카드 취소완료 후, 3~5일 내 카드사 승인취소(영업일 기준) 신용카드 승인취소
계좌이체 실시간 계좌이체 또는 무통장입금
취소완료 후, 입력하신 환불계좌로 1~2일 내 환불금액 입금(영업일 기준)
계좌입금
휴대폰 결제 당일 구매내역 취소시 취소 완료 후, 6시간 이내 승인취소
전월 구매내역 취소시 취소 완료 후, 1~2일 내 환불계좌로 입금(영업일 기준)
당일취소 : 휴대폰 결제 승인취소
익월취소 : 계좌입금
포인트 취소 완료 후, 당일 포인트 적립 환불 포인트 적립
06. 취소반품 불가 사유
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  • 각 상품별로 아래와 같은 사유로 취소/반품이 제한 될 수 있습니다.

환불불가
상품군 취소/반품 불가사유
의류/잡화/수입명품 상품의 택(TAG) 제거/라벨 및 상품 훼손으로 상품의 가치가 현저히 감소된 경우
계절상품/식품/화장품 고객님의 사용, 시간경과, 일부 소비에 의하여 상품의 가치가 현저히 감소한 경우
가전/설치상품 전자제품 특성 상, 정품 스티커가 제거되었거나 설치 또는 사용 이후에 단순변심인 경우, 액정화면이 부착된 상품의 전원을 켠 경우 (상품불량으로 인한 교환/반품은 AS센터의 불량 판정을 받아야 합니다.)
자동차용품 상품을 개봉하여 장착한 이후 단순변심의 경우
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내비게이션, OS시리얼이 적힌 PMP 상품의 시리얼 넘버 유출로 내장된 소프트웨어의 가치가 감소한 경우
노트북, 테스크탑 PC 등 홀로그램 등을 분리, 분실, 훼손하여 상품의 가치가 현저히 감소하여 재판매가 불가할 경우
Category
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  • 어제 방문자 593 명
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  • 전체 방문자 262,248 명
  • 전체 게시물 1,513 개
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