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반도체의부가가치를올리는패키지와테스트

서민석

고객평점
발행일2020.03.10
판형변형판
쪽수332
ISBN9791156858577
판매가격 22,800원
배송비결제주문시 결제

총 금액 : 0원

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- 책소개 -


 이 책은 반도체 패키지와 테스트의 입문서입니다. 반도체 업계에 입문하려는 학생들에게는 방향을 제시하는 지침서의 역할을 하 게 될 것입니다. 또한 패키지와 테스트 관련 업무에 종사하는 분들과 유관 업무를 하고 계신 분 들에게는 이해도를 향상시켜드리게 될 것입니다. 나아가 패키지, 테스트의 장비와 소재를 만드는 분들에게도 이 책의 지식들이 해 당 업무의 효율을 높이는 데 기여할 것이라 생각됩니다.

 제1장에서는 테스트 장비와 프로세스, 대략적인 테스트 항목에 대해 설명하였고, 제2장에서는 패키지의 정의와 역할, 기술 개발 트렌드, 기술 개발 프로세스 등을 설 명하였습니다. 제3장에서는 패키지의 종류를 분류하고, 각 종류별 특징, 장단점 등을 기술하였습니다.

제4장에서는 패키지 설계와 해석을 설명하였는데, 패키지 설계와 칩 설계의 차이점을 알리고, 설계 및 공정 효율을 높이기 위한 구조, 열, 전기 해석 내용과 과정 을 소개하였습니다. 제5장은 패키지 공정을 설명하는 장인데, 종류별 공정 순서와 각 공정들의 진행방 법과 의미를 소개하였습니다.

제6장에서는 패키지 공정 진행을 위해서 사용되는 재료들을 소개하였고, 제7장에서는 품질과 신뢰성의 의미 및 신뢰성 평가 항목들의 진행 방법과 목적을 설명하였습니다.


- 목차 -


01 반도체

테스트의 이해


01.  반도체 후공정 ······················································ 5

02.  테스트의 종류······················································ 8

03.  웨이퍼 테스트 ···················································· 10

  EPM ································································ 13

  웨이퍼 번인······················································· 13

  테스트 ····························································· 14

  리페어······························································ 15

04.  패키지 테스트 ···················································· 16

  TDBI································································ 17

  테스트 ····························································· 18

  외관 검사·························································· 18


02 반도체
패키지의 정의와 역할


01.  반도체 패키지의 정의········································· 25

02.  반도체 패키지의 역할 ········································ 26

03.  반도체 패키지의 개발 트렌드····························· 28

04.  반도체 패키지 개발 과정 ··································· 31


03 반도체

패키지의 종류


01.  반도체 패키지의 분류······················································ 39

02.  컨벤셔널 패키지·······························································41

  플라스틱 패키지 - 리드프레임 타입 패키지··························41

  플라스틱 패키지 - 서브스트레이트 타입 패키지 ·················· 43

  세라믹 패키지 ································································ 46

03.  웨이퍼 레벨 패키지························································· 47

  웨이퍼 레벨 패키지 ························································· 47

  재배선··········································································· 56

  플립 칩·········································································· 58

04.  적층 패키지····································································· 66

  패키지 적층 ··································································· 67

  칩 적층 - Chip Stack with Wire Bonding··························· 70

  실리콘 관통 전극 - Chip Stack with TSV ··························· 73

05.  시스템 인 패키지····························································· 86


04 반도체

패키지 설계와 해석


01.  반도체 패키지 설계 ························································· 97

02.  구조 해석······································································· 101

  휨 해석········································································ 104

  솔더 접합부 신뢰성 ······················································· 106

  강도 해석····································································· 108

03.  열 해석 ·········································································· 109

04.  전기 해석 ······································································113


05 반도체
패키지 공정


01.  컨벤셔널 패키지 공정·······································123

  백 그라인딩 ····················································124

  웨이퍼 절단·····················································127

  다이 어태치 ····················································131

  인터커넥션······················································137

  몰딩·······························································143

  마킹·······························································144

  트리밍 – 리드프레임·········································146

  솔더 도금 – 리드프레임·····································147

  성형 – 리드프레임············································147

  솔더 볼 마운팅 – 서브스트레이트 ·······················148

  싱귤레이션 - 서브스트레이트 ····························152

02.  웨이퍼 레벨 패키지 공정··································153

  포토 공정 ·······················································156

  스퍼터링 공정 ················································· 161

  전해도금 공정 ·················································163

  습식 공정 – PR 스트립과 금속 에칭 ····················166

  팬인 WLCSP 공정············································167

  솔더 볼 마운팅 공정·········································168

  플립 칩 범프 공정 ············································169

  재배선 공정 ····················································171

  팬아웃 WLCSP 공정·········································172

  실리콘 관통 전극 패키지 공정···························· 174

03.  검사와 측정······················································187

  검사·······························································187

  측정·······························································192


06 반도체
패키지 재료


01.  컨벤셔널 패키지 재료···················································· 208

  리드프레임 ·································································· 208

  서브스트레이트···························································· 210

  접착제········································································· 217

  에폭시 몰딩 컴파운드···················································· 222

  솔더 ··········································································· 225

  테이프········································································· 228

  와이어 ········································································ 229

  포장 재료 ···································································· 230

02.  웨이퍼 레벨 패키지 재료··············································· 231

  포토 레지스트 ······························································ 231

  도금 용액····································································· 234

  PR 스트립퍼································································· 235

  에천트········································································· 237

  스퍼터 타깃 ································································· 238

  언더필········································································· 238

  캐리어와 접착제, 마운팅 테이프······································ 240


07 반도체
패키지 신뢰성

01.  신뢰성 의미 ··································································· 247

02.  JEDEC 기준··································································· 248

03.  수명 신뢰성 시험··························································· 253

  EFR ············································································ 253

  HTOL ········································································· 254

  LTOL ·········································································· 255

  HTSL ·········································································· 256

  LTSL··········································································· 257

  Endurance ····················································· 257

  Data Retention··············································· 258

04.  환경 신뢰성 시험·············································· 259

  Preconditioning·············································· 259

  TC ································································· 263

  TS ································································· 268

  THS······························································· 268

  PCTP······························································269

  UHAST ·························································· 270

  HAST····························································· 271

  HALT····························································· 272

05.  기계적 신뢰성 시험·········································· 273

  충격································································274

  진동······························································· 275

  구부림 ··························································· 275

  비틀림·····························································276


08 반도체
용어해설

용어해설·································································· 282



- 저자소개 -


서민석 박사는 한국과학기술원 재료공학과에서 학사,석사 학위를 취득하였고, 반도체 패키지를 위한 전해 도금 공정 및 재료 연구로 박사학위를 취득하였다.

이후 SK하이닉스 반도체에서 SRAM & Flash 공정 개발에 참여하였다가 2003년부터 반도체 패키지 개발 부서에서 RDL, Flip Chip, Fan in WLCSP, TSV(HBM, 3DS, Wide IO)등의 Wafer Level Package 개발을 주관하였다.



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반품 배송비
반품사유 반품 배송비 부담자
단순변심 고객 부담이며, 최초 배송비를 포함해 왕복 배송비가 발생합니다. 또한, 도서/산간지역이거나 설치 상품을 반품하는 경우에는 배송비가 추가될 수 있습니다.
상품의 불량 또는 오배송 고객 부담이 아닙니다.
03. 배송상태에 따른 환불안내
환불안내
진행 상태 결제완료 상품준비중 배송지시/배송중/배송완료
어떤 상태 주문 내역 확인 전 상품 발송 준비 중 상품이 택배사로 이미 발송 됨
환불 즉시환불 구매취소 의사전달 → 발송중지 → 환불 반품회수 → 반품상품 확인 → 환불
04. 취소방법
  • 결제완료 또는 배송상품은 1:1 문의에 취소신청해 주셔야 합니다.
  • 특정 상품의 경우 취소 수수료가 부과될 수 있습니다.
05. 환불시점
환불시점
결제수단 환불시점 환불방법
신용카드 취소완료 후, 3~5일 내 카드사 승인취소(영업일 기준) 신용카드 승인취소
계좌이체 실시간 계좌이체 또는 무통장입금
취소완료 후, 입력하신 환불계좌로 1~2일 내 환불금액 입금(영업일 기준)
계좌입금
휴대폰 결제 당일 구매내역 취소시 취소 완료 후, 6시간 이내 승인취소
전월 구매내역 취소시 취소 완료 후, 1~2일 내 환불계좌로 입금(영업일 기준)
당일취소 : 휴대폰 결제 승인취소
익월취소 : 계좌입금
포인트 취소 완료 후, 당일 포인트 적립 환불 포인트 적립
06. 취소반품 불가 사유
  • 단순변심으로 인한 반품 시, 배송 완료 후 7일이 지나면 취소/반품 신청이 접수되지 않습니다.
  • 주문/제작 상품의 경우, 상품의 제작이 이미 진행된 경우에는 취소가 불가합니다.
  • 구성품을 분실하였거나 취급 부주의로 인한 파손/고장/오염된 경우에는 취소/반품이 제한됩니다.
  • 제조사의 사정 (신모델 출시 등) 및 부품 가격변동 등에 의해 가격이 변동될 수 있으며, 이로 인한 반품 및 가격보상은 불가합니다.
  • 뷰티 상품 이용 시 트러블(알러지, 붉은 반점, 가려움, 따가움)이 발생하는 경우 진료 확인서 및 소견서 등을 증빙하면 환불이 가능하지만 이 경우, 제반 비용은 고객님께서 부담하셔야 합니다.
  • 각 상품별로 아래와 같은 사유로 취소/반품이 제한 될 수 있습니다.

환불불가
상품군 취소/반품 불가사유
의류/잡화/수입명품 상품의 택(TAG) 제거/라벨 및 상품 훼손으로 상품의 가치가 현저히 감소된 경우
계절상품/식품/화장품 고객님의 사용, 시간경과, 일부 소비에 의하여 상품의 가치가 현저히 감소한 경우
가전/설치상품 전자제품 특성 상, 정품 스티커가 제거되었거나 설치 또는 사용 이후에 단순변심인 경우, 액정화면이 부착된 상품의 전원을 켠 경우 (상품불량으로 인한 교환/반품은 AS센터의 불량 판정을 받아야 합니다.)
자동차용품 상품을 개봉하여 장착한 이후 단순변심의 경우
CD/DVD/GAME/BOOK등 복제가 가능한 상품의 포장 등을 훼손한 경우
내비게이션, OS시리얼이 적힌 PMP 상품의 시리얼 넘버 유출로 내장된 소프트웨어의 가치가 감소한 경우
노트북, 테스크탑 PC 등 홀로그램 등을 분리, 분실, 훼손하여 상품의 가치가 현저히 감소하여 재판매가 불가할 경우
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